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Broadcom's HSPA Platform for TCL

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Broadcom Corporation recently revealed that its 3G High Speed Packet Access (HSPA)+ platform, BCM28145, will be used by TCL Communication Technology Holdings Ltd. (TCCLF), a global manufacturer of mobile and internet products, for its new J310 Android-based smartphones.

The J310 smartphone features the latest Android 4.2 Jelly Bean operating system, a 1.2GHz dual Cortex A9 processor with dual vector processing unit multimedia engine, HSPA+ modem and 3G/2G dual-SIM dual-standby function. Broadcom's economical BCM28145 chipset enables TCL Communication to power its entry-level smartphone to fully exploit China’s fast-expanding 3G service market.

Demand for high-performance and cost-effective handsets are continuously on the rise as increasing number of consumers are opting for smartphones. As per research firm ABI Research, smartphones worth $250 or less will contribute 46% of the smartphone market by 2018, up from 28% in 2012.

Broadcom continues to invest in and drive innovation and engineering excellence across a broad range of communication products to help its customers enhance device performance, cut down costs, and improve overall power efficiency. Broadcom's HSPA platform integrates cellular baseband processors with connectivity solutions and advanced technologies.

Based in Irvine, CA, Broadcom is engaged in designing and marketing semiconductor components of network voice, video, and data traffic for various applications. The company continues to drive innovation and engineering excellence across a broad range of communication end markets to help its customers enhance device performance and overall efficiency.

Broadcom currently has a Zacks Rank #2 (Buy). Other stocks that look promising and are worth a look are Towerstream Corporation and iSoftStone Holdings Limited , each carrying a Zacks Rank #2 (Buy).


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