Micron, Intel Update 2nd Generation 3D XPoint Partnership

INTC MU MRVL

Micron (MU - Free Report) and Intel (INTC - Free Report) took forward their long-standing relationship by updating the terms of their 3D XPoint joint development partnership formed in July 2015. The alliance resulted in the development of non-volatile memory that was “1000X faster” and more reliable/endurable than NAND.

The updated technology will meet the growing demand for personal storage and also cater to the media and entertainment market.

The companies noted that they will jointly develop the second generation 3D XPoint technology by first-half of 2019 at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, UT.

Notably, this partnership will be terminated after the companies develop their second generation 3D XPoint. Intel and Micron will develop technology independently thereafter, enabling them to tailor products per their business needs.

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