We use cookies to understand how you use our site and to improve your experience. This includes personalizing content and advertising. To learn more, click here. By continuing to use our site, you accept our use of cookies, revised Privacy Policy and Terms of Service.
You are being directed to ZacksTrade, a division of LBMZ Securities and licensed broker-dealer. ZacksTrade and Zacks.com are separate companies. The web link between the two companies is not a solicitation or offer to invest in a particular security or type of security. ZacksTrade does not endorse or adopt any particular investment strategy, any analyst opinion/rating/report or any approach to evaluating individual securities.
If you wish to go to ZacksTrade, click OK. If you do not, click Cancel.
Applied Materials Extends Partnership with A*STAR's IME
Read MoreHide Full Article
Applied Materials, Inc. (AMAT - Free Report) has decided to take forward its research collaboration with the Institute of Microelectronics (IME) and extend it for another five years.
IME is a research unit under the Science and Engineering Research Council (SERC), Agency for Science, Technology and Research (A*Star) that operates with a view to add value to Singapore's semiconductor industry.
Inside the Extension Plan
The duo’s main focus is on developing ways to make chips and associated devices, smaller, smarter and faster. To achieve this, the duo will focus their R&D efforts toward Fan-Out Wafer-Level Packaging (FOWLP).
FOWLP is a key technology platform that enables integration of multiple chips in a small form factor on a single package. This platform is increasingly gaining significance with the rapid evolution of Internet of Things (IOT) and big data in the connected devices market.
The idea is to speed up the ongoing advancements that IME has been making with semiconductor hardware, process and device structures, leveraging on Applied Materials, Wafer-Level Packaging (WLP) processing equipment.
The duo will make a combined investment of $188 million to expand their Centre of Excellence in Advanced Packaging to a second location at Fusionopolis 2. The center has an existing facility at Singapore’s Science Park II. The two facilities combined will cover around 1,700 square meters and employ nearly 100 scientists, engineers and researchers.
The Singapore center in already engaged in multi-disciplinary research aiming to innovate across advanced packaging technologies such as bump, 2.5D interposers, TSV and now FOWLP.
The move makes sense for Applied Materials as it could make use of this joint hub in developing advanced technologies and products for international markets.
As far as IME is concerned, the move will help it to boost the microelectronics industry in Singapore leveraging on Applied Materials’ innovative technology.
Zacks Rank and Stocks to Consider
Currently, Applied Materials is a Zacks Rank #2 (Buy) company. Better-ranked stocks in the broader technology sector include Facebook, Inc. , Yirendai Ltd. (YRD - Free Report) and LinkedIn Corporation , each sporting a Zacks Rank #1 (Strong Buy). You can see the complete list of today’s Zacks #1 Rank stocks here.
Confidential from Zacks
Beyond this Analyst Blog, would you like to see Zacks' best recommendations that are not available to the public? Our Executive VP, Steve Reitmeister, knows when key trades are about to be triggered and which of our experts has the hottest hand. Click to see them now>>
See More Zacks Research for These Tickers
Normally $25 each - click below to receive one report FREE:
Image: Bigstock
Applied Materials Extends Partnership with A*STAR's IME
Applied Materials, Inc. (AMAT - Free Report) has decided to take forward its research collaboration with the Institute of Microelectronics (IME) and extend it for another five years.
IME is a research unit under the Science and Engineering Research Council (SERC), Agency for Science, Technology and Research (A*Star) that operates with a view to add value to Singapore's semiconductor industry.
Inside the Extension Plan
The duo’s main focus is on developing ways to make chips and associated devices, smaller, smarter and faster. To achieve this, the duo will focus their R&D efforts toward Fan-Out Wafer-Level Packaging (FOWLP).
FOWLP is a key technology platform that enables integration of multiple chips in a small form factor on a single package. This platform is increasingly gaining significance with the rapid evolution of Internet of Things (IOT) and big data in the connected devices market.
The idea is to speed up the ongoing advancements that IME has been making with semiconductor hardware, process and device structures, leveraging on Applied Materials, Wafer-Level Packaging (WLP) processing equipment.
The duo will make a combined investment of $188 million to expand their Centre of Excellence in Advanced Packaging to a second location at Fusionopolis 2. The center has an existing facility at Singapore’s Science Park II. The two facilities combined will cover around 1,700 square meters and employ nearly 100 scientists, engineers and researchers.
The Singapore center in already engaged in multi-disciplinary research aiming to innovate across advanced packaging technologies such as bump, 2.5D interposers, TSV and now FOWLP.
APPLD MATLS INC Price
APPLD MATLS INC Price | APPLD MATLS INC Quote
A Win-win Situation
The move makes sense for Applied Materials as it could make use of this joint hub in developing advanced technologies and products for international markets.
As far as IME is concerned, the move will help it to boost the microelectronics industry in Singapore leveraging on Applied Materials’ innovative technology.
Zacks Rank and Stocks to Consider
Currently, Applied Materials is a Zacks Rank #2 (Buy) company. Better-ranked stocks in the broader technology sector include Facebook, Inc. , Yirendai Ltd. (YRD - Free Report) and LinkedIn Corporation , each sporting a Zacks Rank #1 (Strong Buy). You can see the complete list of today’s Zacks #1 Rank stocks here.
Confidential from Zacks
Beyond this Analyst Blog, would you like to see Zacks' best recommendations that are not available to the public? Our Executive VP, Steve Reitmeister, knows when key trades are about to be triggered and which of our experts has the hottest hand. Click to see them now>>